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Reprinted from 184412253 at 02:06 on March 4,
puma ferrari shoes, 2010 Reading (loading. ..) Comments (1) Category: Personal Diary Pictures of various IC packages Posted: at 20:44:57 on October 29th,
puma mens shoes, 2007 Reading (30) Comments (4) special effects: [map] This link:
various IC Pictures of various IC package picture package BGA
Ball Grid ArrayEBGA 680LLBGA 160L PBGA 217L Plastic Ball Grid Array
SBGA 192LTSBGA 680LCLCCCNR Communication and Networking Riser Specification Revision 1.2CPGA
Ceramic Pin Grid ArrayDIP
Dual Inline PackageDIP-tab
Dual Inline Package with Metal HeatsinkFBGAFDIPFTO220Flat PackHSOP28ITO220ITO3pJLCCLCCLDCCLGALQFPPCDIPPGA
Plastic Pin Grid ArrayPLCCPQFPPSDIP
LQFP 100LMETAL QUAD 100LPQFP 100LQFP
Quad Flat PackageSOT220SOT223SOT223SOT23SOT23/SOT323SOT25/SOT353SOT26/SOT363SOT343SOT523SOT89SOT89Socket 603
FosterLAMINATE TCSP 20L
Chip Scale PackageTO252TO263/TO268SO DIMM
Small Outline Dual In-line Memory ModuleSOCKET 370
For intel 370 pin PGA Pentium III & Celeron CPUSOCKET 423
For intel 423 pin PGA Pentium 4 CPUSOCKET 462/SOCKET A
For PGA AMD Athlon & Duron CPUSOCKET 7
For intel Pentium & MMX Pentium CPUQFP
Quad Flat PackageTQFP 100LSBGASC-70 5L
SDIPSIP
Single Inline PackageSO
Small Outline Package SOJ 32LSOJSOP EIAJ TYPE II 14LSOT220SSOP 16L
SSOPTO18TO220TO247TO264TO3TO5TO52TO71TO72TO78TO8TO 92TO93TO99TSOP
Thin Small Outline PackageTSSOP or TSOP II
Thin Shrink Outline PackageuBGA
Micro Ball Grid ArrayuBGA
Micro Ball Grid Array ZIP
Zig-Zag Inline PackageC-Bend Lead CERQUAD
Ceramic Quad Flat PackCeramic CaseLAMINATE CSP 112L
Chip Scale PackageGull Wing Leads LLP 8LaPCI 32bit 5V
Peripheral Component InterconnectPCI 64bit 3.3V
Peripheral Component InterconnectPCMCIAPDIPPLCCSIMM30
For AMD Athlon CPUSNAPTKSNAPTKSNAPZPSOH
Hybrid Mode
